The recent subject of research in the electronic packaging industry has been technological methods to increase the durability of solder joints. The SAC305 solder joint was used in this research to analyze the mechanical properties of ultrasonic vibration for them. The effect of ultrasonic vibration (USV) respect to range of time within (0sec to 6 sec) on the solder joints properties was characterized systematically. In this study after verification of this computer simulation with experimental results and the results showed it was confidence 87% ,after validation new parameters have been suggested to discover the better mechanical properties for the solder joints and these parameters are deferent range of frequency for specific period of time and substrate material which will be between two plate of copper Cu ,then input all these parameters to ANSYS to analysis the inputs and the output of computer simulation is shear strength . The findings of the numerical analysis revealed that the maximal shear strength for SAC305 alloy was 31.6Mpa when it was eventually treated with 80 kHz for 1.5 sec, this analysis found that the better way to boost mechanical properties for Cu / SAC305 / Cu solder alloy treats this solder joint with frequency 80 kHz for 1.5 sec to achieve optimum shear strength value.