Manuscript Title:

MEASUREMENT AND CHARACTERIZATION METHODS IN FUNCTIONAL THIN FILM DEPOSITION IN PLASMA SPUTTERING FOR MATERIAL PROCESSING

Author:

MD. AMZAD HOSSAIN, MD ABDUL MAJED PATWARY, FATEMA TUZ ZAHURA, MD. MUSTAFIZUR RAHMAN

DOI Number:

DOI:10.17605/OSF.IO/DH3UQ

Published : 2022-01-23

About the author(s)

1. MD. AMZAD HOSSAIN - Department of Electrical and Electronic Engineering, Jashore University of Science and Technology, Jashore -7408, Bangladesh & Graduate School of Science and Engineering, Saga University, Saga, 840-8502, Japan.
2. MD ABDUL MAJED PATWARY - Department of Chemistry, Comilla University, Cumilla -3506, Bangladesh & Graduate School of Science and Engineering, Saga University, Saga, 840-8502, Japan.
3. FATEMA TUZ ZAHURA - Department of Electrical and Electronic Engineering, Jashore University of Science and Technology, Jashore -7408, Bangladesh.
4. MD. MUSTAFIZUR RAHMAN - Department of Electrical and Electronic Engineering, Jashore University of Science and Technology, Jashore -7408, Bangladesh.

Full Text : PDF

Abstract

This study discussed the experimental methods as well as measurement techniques used in functional thin film characterization. Various kinds of measurement tools and diagnostics were represented and well discussed. Material characterization methods were used to analyze the structure of the fabricated crystal, chemical composition, thickness, surface morphology, conductivity, as well as its optical properties. Each of the measurement and characterization techniques was explained. The evaluation of the prepared functional film was analyzed by some useful technical tools such as surface profiler, four-point probe method, atomic force microscopy (AFM), scanning force microscopy (SEM), Raman spectroscopy, X-ray diffraction (XRD), Ultraviolet Visible Near-Infrared (UV-Vis-NIR) spectroscopy. A Langmuir probe was used to measure ion saturation current and for estimation of plasma density.Furthermore, the simulation analysis techniques used for the magnetized plasma sputtering source were also presented.


Keywords

Thin film, Plasma sputtering, Material processing, Thickness, Resistivity, AFM, SEM, XRD, UV-Vis-NIR