1. BACHIR BACHIR BOUIADJRA - LMPM, Institute of Maintenance and Industrial Safety, University of Oran2 Mohamed Ben Ahmed; P.B 1015
El M’naouer 31000 Oran Algeria.
2. HABIB ACHACHE - Institute of Maintenance and Industrial Safety, University of Oran 2 Mohamed Ben Ahmed, B.P 1015 El
M’naouer Oran 31000, Algeria, Laboratory of Physical Mechanics of Materials Sidi Bel Abbes, Algeria.
3. MAWLOUD TITAH - MAWLOUD TITAH
LISSDE, Institute of Maintenance and Industrial Safety, University of Oran2 Mohamed Ben Ahmed; P.B
1015 El M’naouer 31000 Oran Algeria
4. BELABBES BACHIR BOUIADJRA - LMPM, Faculté of Technologie, University of Djilali Liabes Sidi Bel Abbes, BP 89 Cité Ben M’hidi, 22000
Sidi Bel Abbes, Algeria.
5. YASSINE KHALFI - LGPME, Faculté of Technologie, University of Djilali Liabes Sidi Bel Abbes, BP 89 Cité Ben M’hidi, 22000
Sidi Bel Abbes, Algeria
6. DJAAFAR AIT KACI - Department of Mechanical Engineering, University of Djillali Liabes Sidi Bel Abbes, 22000, Algeria.
7. RACHID ZAHI - Department of Mechanical Engineering, University of Relizane, BP 48000 Algeria, Laboratory of Mechanics
of Structures and Solids LMSS, University of Sidi Bel Abbes Algeria.
In this study the finite element method is used to analyse the distribution of failure stresses in circular aperture wire plates with different type of stiffener location. The stress distribution in the adhesive layer will be analysed to estimate the durability of the repair technique by varying the different stiffener parameter, this analysis allows the designers to optimise the location of the stiffener used for the repair of the structures, the results obtained showed the best locations of the stiffener used for the repair of the structures. This study provides a novel approach to optimizing stiffener locations in repair techniques, enhancing the durability and efficiency of structural repairs through detailed finite element analysis.
The Finite Element Method, Stiffener, the Durability, the Stress Distribution, the Adhesive Layer, Optimizing Stiffener, Failure Stresses.